---
title: "WizFi360 Pin 23"
url: "https://maker.wiznet.io/forum/14212"
markdown_url: "https://maker.wiznet.io/forum/14212/md"
type: "Forum topic"
category: "Wireless"
author: "DC123"
created: "2021-04-08T23:57:15+09:00"
last_activity: "2021-04-20T05:14:05+09:00"
language: "en"
views: 527
replies: 1
source: "WIZnet Makers forum (https://maker.wiznet.io/forum/)"
---

# WizFi360 Pin 23

## Question

Asked by DC123 on 2021-04-08 in Wireless.

The data sheet for the WizFi360 describes pins 1-22, but there’s also a large 4.50mm x 4.25mm pad under the module. Should this pad be soldered to the host pcb, and is it electrically connected to the GND pin? Which document describes the purpose of this pad and what, if anything, should/shouldn’t be done with it?

## Replies

### Reply 1 by viktor, 2021-04-20

Hello,

Sorry for late response.
This 4.5mm x 4.25mm pad is used to widen heat and GND surface.
You can connect it to GND.

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Source: https://maker.wiznet.io/forum/14212