---
title: "Manufacturing process requirements"
url: "https://maker.wiznet.io/forum/11918"
markdown_url: "https://maker.wiznet.io/forum/11918/md"
type: "Forum topic"
category: "Wireless"
author: "slayervv"
created: "2016-09-01T22:52:00+09:00"
last_activity: "2017-05-04T08:39:25+09:00"
language: "en"
views: 771
replies: 2
source: "WIZnet Makers forum (https://maker.wiznet.io/forum/)"
---

# Manufacturing process requirements

## Question

Asked by slayervv on 2016-09-01 in Wireless.

Are there any limitations on cleaning processes used on circuit board assemblies with the WIZFi220 module installed. Specifically, can the module be immersed in water as part of the cleaning process after reflow?

## Replies

### Reply 1 by cliff, 2016-11-28

Hi,

I am not sure that it won’t be a problem.
SO, please avoid the board is touched by water as much as possible.

Thank you.

### Reply 2 by slayervv, 2016-11-28

Thank you so much for your timely response. ![:unamused:](https://emoji.discourse-cdn.com/twitter/unamused.png?v=12)

---

Source: https://maker.wiznet.io/forum/11918