This generation of the project utilizes an Ethernet shield running on an Arduino Mega development board. It also has the added feature of temperature monitoring. The thermal probe is strapped to the back of the P.A. heatsink assembly for now. I plan to test locating the thermal probe inside the P.A. final stage cavity, but it remains to be seen whether the high level of RF inside the cavity may interfere with the circuitry which is actually located inside the working end of the probe.